Description:

This breakout board was designed for the Texas Instruments DRV8329 chip.  It features a 0.6 inch row spacing and 0.1in (2.54mm) pin pitch for the DIP headers.  This 4mm x 5mm package is quite small. The center pad is difficult to solder, and requires a hot air machine to install the part.   

Since this could be used for other chips, the thermal pad is not connected to any specific header pins.  Instead, there are large test points that should be wired to whatever pin the pad is internally connected to.

If there is a specific breakout board that you need but it doesn't exist, please contact us.  In most cases it can be delivered in about 2 weeks.